Making Silicon Wafers


The ingot goes to a wire saw machine, where it is cut into wafers. The taut wire runs through abrasive slurry, which acts as the cutting agent between the work piece and wire. Saw marks and surface defects are removed from the front and back sides of the wafer in a process known as “lapping.” The wafers then go through an etching and cleaning process using abrasive chemicals to alleviate microscopic cracks and surface damage, and the edges of the wafer are ground to prevent breakage. This is a harsh process, involving abrasive liquids and sharp silicon particles that must be continually drained, filtered, and circulated with extremely durable pumping systems. Pumps must be made of materials hard enough to protect against the highly abrasive, viscous fluids.


ALMATEC Maschinenbau GmbH

Carl-Friedrich-Gauß-Straße 5
47475 Kamp-Lintfort


Tel. +49/2842/961-0
Fax. +49/2842/961-40
Mail: info@almatec.de